IRIS
RINALDI, NICCOLO'
 Distribuzione geografica
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Continente #
AS - Asia 5.157
NA - Nord America 5.120
EU - Europa 3.746
SA - Sud America 667
AF - Africa 95
Continente sconosciuto - Info sul continente non disponibili 8
OC - Oceania 2
Totale 14.795
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Nazione #
US - Stati Uniti d'America 4.955
SG - Singapore 2.492
RU - Federazione Russa 1.771
VN - Vietnam 906
CN - Cina 882
BR - Brasile 536
HK - Hong Kong 449
IT - Italia 332
UA - Ucraina 306
DE - Germania 294
IE - Irlanda 223
FR - Francia 199
FI - Finlandia 195
NL - Olanda 160
CA - Canada 86
JP - Giappone 85
GB - Regno Unito 84
IN - India 82
SE - Svezia 79
AR - Argentina 51
MX - Messico 48
BD - Bangladesh 32
IQ - Iraq 28
PH - Filippine 25
PL - Polonia 20
KR - Corea 19
TH - Thailandia 19
VE - Venezuela 19
ZA - Sudafrica 19
CH - Svizzera 18
ID - Indonesia 18
MA - Marocco 17
TR - Turchia 17
TW - Taiwan 16
EC - Ecuador 15
ES - Italia 14
PE - Perù 13
PK - Pakistan 12
CO - Colombia 11
UZ - Uzbekistan 11
CZ - Repubblica Ceca 10
JM - Giamaica 8
PY - Paraguay 8
AT - Austria 7
JO - Giordania 7
KE - Kenya 7
NP - Nepal 7
EU - Europa 6
GT - Guatemala 6
LT - Lituania 6
SA - Arabia Saudita 6
TN - Tunisia 6
UY - Uruguay 6
BO - Bolivia 5
LB - Libano 5
NG - Nigeria 5
BB - Barbados 4
BE - Belgio 4
CY - Cipro 4
DZ - Algeria 4
KZ - Kazakistan 4
MY - Malesia 4
AL - Albania 3
CI - Costa d'Avorio 3
CL - Cile 3
DO - Repubblica Dominicana 3
EG - Egitto 3
GE - Georgia 3
HR - Croazia 3
KG - Kirghizistan 3
LV - Lettonia 3
ML - Mali 3
PS - Palestinian Territory 3
TZ - Tanzania 3
AE - Emirati Arabi Uniti 2
AO - Angola 2
AZ - Azerbaigian 2
BG - Bulgaria 2
CG - Congo 2
CM - Camerun 2
CR - Costa Rica 2
DK - Danimarca 2
HN - Honduras 2
KW - Kuwait 2
MZ - Mozambico 2
QA - Qatar 2
RO - Romania 2
RS - Serbia 2
SK - Slovacchia (Repubblica Slovacca) 2
ZM - Zambia 2
AF - Afghanistan, Repubblica islamica di 1
AM - Armenia 1
AU - Australia 1
BH - Bahrain 1
BJ - Benin 1
BM - Bermuda 1
BN - Brunei Darussalam 1
BW - Botswana 1
BY - Bielorussia 1
CU - Cuba 1
Totale 14.765
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Città #
Singapore 1.081
San Jose 645
Chandler 463
Moscow 450
Hong Kong 428
Ashburn 400
Jacksonville 275
Beijing 272
Ho Chi Minh City 263
Santa Clara 253
Hanoi 227
The Dalles 195
Princeton 174
Millbury 169
Amsterdam 145
Lauterbourg 140
Boston 128
Woodbridge 121
Nanjing 118
Los Angeles 106
Wilmington 79
Buffalo 69
Tokyo 65
Munich 59
New York 54
Ottawa 54
Napoli 53
Houston 46
São Paulo 46
Des Moines 45
Ann Arbor 42
Da Nang 42
Redondo Beach 39
Dallas 38
Hebei 34
Council Bluffs 31
Kronberg 29
Chicago 28
Naples 28
Haiphong 27
Frankfurt am Main 26
Nanchang 26
Shenyang 26
Norwalk 25
Jiaxing 23
Pune 22
Rio de Janeiro 21
Mexico City 20
Seattle 20
Turku 20
Cagliari 18
Redwood City 18
Washington 18
Atlanta 17
Milan 17
Zurich 17
Belo Horizonte 16
Boardman 16
Brooklyn 16
Chennai 16
Helsinki 16
Orem 16
Tianjin 16
Changsha 15
London 15
San Francisco 14
Stockholm 14
Can Tho 13
Brasília 12
Shanghai 12
Denver 11
Duncan 11
Falls Church 11
Guangzhou 11
Hefei 11
Hải Dương 11
Johannesburg 11
Kunming 11
Toronto 11
Warsaw 11
Dublin 10
Fidenza 10
Leawood 9
Ninh Bình 9
Orange 9
Quận Ba 9
Tashkent 9
Campinas 8
Dhaka 8
Falkenstein 8
Guayaquil 8
Lima 8
Manchester 8
Montreal 8
Rome 8
Sunnyvale 8
Thái Bình 8
Baghdad 7
Biên Hòa 7
Cologne 7
Totale 7.778
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Nome #
Numerical analysis of the dynamic thermal behavior of RF bipolar transistors 197
SPICE modeling and dynamic electrothermal simulation of SiC power MOSFETs 161
A SCALABLE PHYSICAL MODEL FOR COPLANAR WAVEGUIDE TRANSITION IN FLIP-CHIP APPLICATIONS 152
Thermally induced current bifurcation in bipolar transistors 147
Effect of heat sources modeling in DC circuit-level electrothermal simulation of power MOSFETs 146
Modellistica analitica e analisi numerica del comportamento termico di transistori bipolari con isolamento a trincea 143
FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC) 142
Thermal feedback blocks for fast and reliable electrothermal circuit simulation of power circuits at module level 140
Studio del fenomeno dell'innesco di instabilita' termiche in MOSFET di potenza per basse tensioni: modellistica analitica e verifica sperimentale 135
Si/SiGe:C and InP/GaAsSb heterojunction bipolar transistors for THz applications 135
Effective electrothermal analysis of electronic devices and systems with parameterized macromodeling 134
Fast nonlinear dynamic compact thermal modeling with multiple heat sources in Ultra-Thin Chip Stacking Technology 133
Analisi degli effetti di auto-riscaldamento in transistori bipolari SOA 132
Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations 132
Model-order reduction procedure for fast dynamic electrothermal simulation of power converters 129
An experimental power-lines model for digital ASICs based on transmission-lines 128
Experimental DC extraction of the base resistance of bipolar transistors: Application to SiGe:C HBTs 128
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies 128
Modellistica analitica e analisi numerica del comportamento termico di dispositivi trench SOI 126
Connecting MOR-based boundary condition independent compact thermal models 124
DESIGN AND CHARACTERIZATION OF A HIGH-RESISTIVITY SILICON TRAVELING WAVE AMPLIFIER FOR 10 GB/S OPTICAL COMMUNICATION SYSTEMS 123
Thermal mapping and 3D numerical simulation of new cellular power MOS affected by electro-thermal instability 120
Compact dynamic modeling for fast simulation of nonlinear heat conduction in ultra-thin chip stacking technology 120
Matrix reduction tool for creating boundary condition independent dynamic compact thermal models 120
ANALYTICAL SOLUTIONS OF THE DIFFUSIVE HEAT EQUATION AS THE APPLICATION FOR MULTI-CELLULAR DEVICE MODELING - A NUMERICAL ASPECT 119
Influence of layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs 119
A Two-Dimensional Analytical Model of Homojunction GaAs BMFET Structures 118
Scaling influence on the thermal behavior of toward-THz SiGe:C HBTs 118
Reliability of high-speed SiGe:C HBT under electrical stress close to the SOA limit 118
Accurate Mobility and Energy Relaxation Time Models for SiGe HBTs Numerical Simulation 117
Analytical modeling and numerical simulations of the thermal behavior of trench-isolated bipolar transistors on SOI substrates 116
Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction 115
Electrothermal behavior of highly-symmetric three-finger bipolar transistors 113
Dynamic electrothermal analysis of bipolar devices and circuits relying on multi-port positive fraction Foster representation 113
Thermal feedback networks for dynamic electrothermal simulations of devices and circuits: A critical perspective 113
Advanced thermal resistance simulation of SiGe HBTs including backend cooling effect 112
Dynamic Electrothermal macromodeling techniques for thermal-aware design of circuits and systems 111
Small-signal operation of semiconductor devices including self-heating, with application to thermal characterization and instability analysis 110
Numerical analysis of the thermal behavior sensitivity to technology parameters and operating conditions in InGaP/GaAs HBTs 110
Thermal effects in thin silicon dies: simulation and modeling 109
Avalanche multiplication and pinch-in models for simulating electrical instability effects in SiGe HBTs 109
Dynamic electrothermal macromodeling: An application to signal integrity analysis in highly integrated electronic systems 109
Calibration of detailed thermal models by parametric dynamic compact thermal models 109
Delphi-like dynamical compact thermal models using model order reduction 109
Thermal design of fully-isolated bipolar transistors 108
Modeling of minority-carrier transport in semiconductor regions with position-dependent material parameters at arbitrary injection levels 107
SILICON AS SMART PACKAGE FOR PHOTONIC ICS 106
Modeling of minority-carrier transport in nonuniformly doped silicon regions with asymptotic expansions 105
Analytical model for thermal instability of low voltage power MOS and S.O.A. in pulse operation 105
Scaling influence on the thermal behavior of toward-THz SiGe:C HBTs 105
A microcontroller-based pulse generator for isothermal I-V measurements 104
Novel MOR approach for extracting dynamic compact thermal models with massive numbers of heat sources 104
Generalized image method with application to the thermal modeling of power devices and circuits 103
Theory of electrothermal behavior of bipolar transistors: Part II - Two-finger devices 103
Finite element modeling for thermal resistance extraction in silicon-on-glass bipolar transistors 103
The EU DOTSEVEN project: Overview and results 102
Multi-port dynamic compact thermal models of nonlinear heat conduction 100
Reliability 100
On the modeling of the transient thermal behavior of semiconductor devices 99
Impact of layout and technology parameters on the thermal resistance of SiGe:C HBTs 98
Influence of scaling and emitter layout on the thermal behavior of toward-THz SiGe:C HBTs 98
Novel partition-based approach to dynamic compact thermal modeling 98
Thermal analysis of solid-state devices and circuits: an analytical approach 97
Impact of scaling on the DC/RF thermal behavior of Terahertz SiGe HBTs 97
Advanced thermal simulation of SiGe:C HBTs including back-end-of-line 97
Advances in electrothermal simulation of solid-state devices and circuits using commercial CAD tools 96
Restabilizing mechanisms after the onset of thermal instability in bipolar transistors 96
Impact of scaling on the DC/RF thermal behavior of SiGe HBTs for high-frequency applications 96
Analysis of the thermal behavior of AlGaN/GaN HEMTs 96
Modeling of small-signal minority-carrier transport in bipolar at arbitrary injection levels 95
Analysis of electrothermal effects in bipolar current mirrors 95
Analysis of the thermal behavior of AlGaN/GaN HEMTs 95
Parameterized thermal macromodeling for fast and effective design of electronic components and systems 95
An Improved Write Driver for Miniaturized Hard Disk Drives 94
A new electro-thermal simulation tool for the analysis of bipolar devices and circuits 94
Evaluating the self-heating thermal resistance of bipolar transistors by DC measurements: A critical review and update 94
TCAD simulation and development within the European DOTFIVE project on 500GHz SiGe:C HBT's 94
Electrothermal reduced equivalents of highly integrated electronic systems with multi-port positive fraction Foster expansion 94
Thermal mapping of new cellular power MOS affected by electro-thermal instability 93
Parametric compact thermal models by moment matching for variable geometry 93
Analysis of the influence of layout and technology parameters on the thermal impedance of GaAs HBT/BiFET using a highly-efficient tool 93
A new SPICE model of VDMOS transistors including thermal and quasi-saturation effects 91
Theory of electrothermal behavior of bipolar transistors: Part III - Impact-ionization 90
Impact of aluminum nitride heatspreaders on the thermal impedance of silicon-on-glass BJTs 90
Time domain dynamic electrothermal macromodeling for thermally aware integrated system design 90
Analytical modeling and numerical simulations of the thermal behavior of trench-isolated bipolar transistors 89
Theory of electrothermal behavior of bipolar transistors: Part I - Single-finger devices 88
Analytical Models of Effective Dos, Saturation Velocity and High-Field Mobility for SiGe HBTs Numerical Simulation 88
Achieving accuracy in device and circuit electro-thermal simulation 87
Thermal transient behavior of silicon-on-glass BJTs 86
Theoretical analysis and modeling of bipolar transistor operation under reversal base current conditions 86
3-D thermal models calibration by parametric dynamic compact thermal models 86
Influence of vertical scaling and temperature on impact-ionization effects in SiGe HBTs 85
Influence of concurrent electrothermal and avalanche effects on the safe operating area of multifinger bipolar transistors 84
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization 84
A critical review of thermal models for electro-thermal simulation 83
A back-wafer contacted silicon-on-glass integrated bipolar process - Part II: A novel analysis of thermal breakdown 83
Evaluation and modeling of voltage stress-induced hot carrier effects in high-speed SiGe HBTs 83
Analytical modeling and numerical simulations of the thermal behavior of bipolar transistors 82
3D dynamic electro-thermal simulator applied to a new cellular power MOS affected by electro-thermal instability 81
Totale 10.830
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Categoria #
all - tutte 51.804
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 51.804
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/2022927 17 3 3 14 5 29 19 40 231 39 116 411
2022/20231.058 190 74 14 110 134 118 3 90 137 137 38 13
2023/2024700 26 115 49 67 48 95 5 88 7 14 134 52
2024/20253.816 251 233 23 19 177 97 464 234 253 269 1.421 375
2025/20266.314 721 467 617 528 1.184 270 701 396 854 403 92 81
2026/2027101 101 0 0 0 0 0 0 0 0 0 0 0
Totale 15.264