CATALANO, ANTONIO PIO
 Distribuzione geografica
Continente #
AS - Asia 2.298
NA - Nord America 1.633
EU - Europa 1.341
SA - Sud America 281
AF - Africa 35
OC - Oceania 3
Continente sconosciuto - Info sul continente non disponibili 1
Totale 5.592
Nazione #
US - Stati Uniti d'America 1.571
SG - Singapore 1.246
CN - Cina 622
RU - Federazione Russa 599
IT - Italia 397
BR - Brasile 243
VN - Vietnam 123
DE - Germania 103
HK - Hong Kong 91
KR - Corea 88
FR - Francia 57
GB - Regno Unito 33
CA - Canada 30
FI - Finlandia 28
NL - Olanda 25
MX - Messico 23
PL - Polonia 20
IE - Irlanda 18
IN - India 18
TW - Taiwan 17
AR - Argentina 15
BD - Bangladesh 14
JP - Giappone 12
SE - Svezia 12
BE - Belgio 10
ES - Italia 10
ID - Indonesia 10
ZA - Sudafrica 10
MA - Marocco 9
EC - Ecuador 7
TR - Turchia 7
LT - Lituania 6
CH - Svizzera 5
IQ - Iraq 5
PK - Pakistan 5
MY - Malesia 4
NP - Nepal 4
VE - Venezuela 4
AE - Emirati Arabi Uniti 3
AT - Austria 3
AZ - Azerbaigian 3
CI - Costa d'Avorio 3
CO - Colombia 3
DO - Repubblica Dominicana 3
IR - Iran 3
JO - Giordania 3
KE - Kenya 3
PE - Perù 3
SA - Arabia Saudita 3
TH - Thailandia 3
UA - Ucraina 3
UZ - Uzbekistan 3
AU - Australia 2
CY - Cipro 2
DK - Danimarca 2
ET - Etiopia 2
HU - Ungheria 2
KG - Kirghizistan 2
LB - Libano 2
RO - Romania 2
SK - Slovacchia (Repubblica Slovacca) 2
UY - Uruguay 2
AL - Albania 1
BA - Bosnia-Erzegovina 1
BJ - Benin 1
BO - Bolivia 1
BW - Botswana 1
CL - Cile 1
CR - Costa Rica 1
DM - Dominica 1
DZ - Algeria 1
EU - Europa 1
GE - Georgia 1
GY - Guiana 1
HN - Honduras 1
KZ - Kazakistan 1
LI - Liechtenstein 1
LU - Lussemburgo 1
MN - Mongolia 1
MQ - Martinica 1
NG - Nigeria 1
PA - Panama 1
PG - Papua Nuova Guinea 1
PY - Paraguay 1
RE - Reunion 1
SV - El Salvador 1
SY - Repubblica araba siriana 1
TN - Tunisia 1
TZ - Tanzania 1
YE - Yemen 1
ZM - Zambia 1
Totale 5.592
Città #
Singapore 571
Dallas 364
Hefei 301
Moscow 162
Naples 138
Beijing 134
Chandler 128
Ashburn 106
Santa Clara 102
Hong Kong 81
Seoul 81
Fairfield 56
Los Angeles 52
Munich 49
Napoli 43
Ho Chi Minh City 40
Hanoi 36
Boston 31
Lawrence 31
New York 29
Buffalo 28
São Paulo 27
Redondo Beach 23
Amsterdam 21
Milan 20
Des Moines 18
Dublin 18
Millbury 17
Frankfurt am Main 15
Warsaw 15
Seattle 14
Mexico City 13
Turku 13
Bacoli 12
Rio de Janeiro 12
Chicago 11
The Dalles 11
Brooklyn 10
Montreal 10
Tokyo 10
Falkenstein 9
Helsinki 9
Nanjing 8
Poplar 8
Atlanta 7
Chennai 7
Dearborn 7
Houston 7
Lauterbourg 7
Nuremberg 7
Ottawa 7
Pomigliano d'Arco 7
Rome 7
Shanghai 7
Acerra 6
Belo Horizonte 6
Biên Hòa 6
Denver 6
Hsinchu 6
Johannesburg 6
Lappeenranta 6
Phoenix 6
Princeton 6
Puglianello 6
San Francisco 6
Wilmington 6
Brasília 5
Brussels 5
Curitiba 5
Dresden 5
Düsseldorf 5
Haiphong 5
New Taipei City 5
Orem 5
Pagani 5
Roubaix 5
São José do Rio Preto 5
Augusta 4
Giugliano in Campania 4
Goiânia 4
Manchester 4
Porto Alegre 4
Quito 4
San Cipriano Picentino 4
Secaucus 4
Stockholm 4
Turin 4
Amalfi 3
Amman 3
Baku 3
Bexley 3
Boydton 3
Bragança Paulista 3
Braunschweig 3
Campinas 3
Caracas 3
Casavatore 3
Catania 3
Caxias do Sul 3
Central 3
Totale 3.163
Nome #
SPICE modeling of Li-ion pouch battery cell including thermo-electrochemical effects 156
Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules 119
Effect of heat sources modeling in DC circuit-level electrothermal simulation of power MOSFETs 118
3-D FEM investigation on electrical ruggedness of double-sided cooling power modules 118
Electrothermal aware design of multichip SiC-based converters for e-mobility 117
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 115
Optimum thermal management design for compact PCB-based high frequency GaN assemblies 111
Model-order reduction procedure for fast dynamic electrothermal simulation of power converters 110
Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update 109
Improving performance of InGaP/GaAs HBT arrays by means of temperature-dependent base ballasting resistors 108
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies 108
Optimization of thermal vias design in PCB-based power circuits 107
Experimental assessment of malfunction events in photovoltaic modules from IR thermal maps 106
Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices 105
Influence of bumps height on electric field in double sided cooling power modules 104
Stress-induced vertical deformations in state-of-the-art power modules: An improved electro-thermo-mechanical approach 103
Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules 102
Thermo-electrochemical simulations in SPICE of Li-Ion batteries under active charge balancing 100
Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors 98
Influence of layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs 97
Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications 97
An efficient simulation methodology to quantify the impact of parameter fluctuations on the electrothermal behavior of multichip SiC power modules 97
Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM-based tool and Design of Experiments 97
Modeling thermal coupling in bipolar power amplifiers toward dynamic electrothermal simulation 96
Diagnosis of power losses in PV plants by means of UAV thermography 96
Experimental validation of analytical models for through-PCB thermal vias 94
Defect detection in double-sided cooled power modules by structure function 92
Numerical analysis of the thermal behavior sensitivity to technology parameters and operating conditions in InGaP/GaAs HBTs 92
Using EMPHASIS for the thermography-based fault detection in photovoltaic plants 92
Electrothermal analysis of GaAs-based HBT arrays for RF power amplifiers 89
Compact modeling of a 3.3 kV SiC MOSFET power module for detailed circuit-level electrothermal simulations including parasitics 88
Analysis of the thermal behavior of Li-ion pouch battery cell – Part II: Circuit-based modeling for fast and accurate thermo-electrochemical simulation 87
In-situ thermal impedance extraction technique applied to a PCB-integrated power device 87
Evaluation of vertical mechanical displacement in SiC-based power modules 87
Study of the thermal behavior of double-sided cooled power modules 86
Analytical modeling of through-PCB thermal vias and heat-sinks for integrated power electronics 85
A priori error bound for moment matching approximants of thermal models 83
Validation of thermometer-based techniques to experimentally extract the impact of nonlinear thermal effects on the thermal resistance of bipolar transistors 81
A study of UIS ruggedness of mismatched paralleled SiC MOSFETs 81
Numerical simulation and analytical modeling of the thermal behavior of single- and double-sided cooled power modules 81
PV fault detection through IR thermography: using EMPHASIS under uneven environmental conditions 81
An approach to the cell-level diagnosis of malfunctioning events in PV panels from aerial thermal maps 80
TCAD-based investigation of a 3.3 kV planar SiC MOSFET: BV-RON trade-off optimization 78
Thermal management solutions for a lightweight 3L GaN inverter 78
Determining the contribution of spatial sub-regions to structure functions 77
Boundary condition independent compact thermal models enhanced by contour elements 75
Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules 75
Coupled structural and functional characterization and modelling of integrated GaN half-bridge power switches 71
Out-of-SOA performance in 3.3 kV SiC MOSFETs: Comparison between planar and quasi-planar trench 70
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part I: Thermometer-based approaches 69
Enhancing electrical ruggedness in double-sided cooled power modules 67
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study 67
In-depth analysis of the electrical ruggedness of double-sided cooled power modules 67
Circuit-based electrothermal simulation of multicellular SiC power MOSFETs using FANTASTIC 67
Analysis of electrothermal effects in devices and arrays in InGaP/GaAs HBT technology 67
Improving the thermal ruggedness of GaAs HBTs through nonuniform base ballasting optimization 66
Improved nonlinear electrothermal simulation of bipolar transistors: Application to InP/InGaAs DHBTs 64
In-situ extraction of the thermal impedance of GaN power HEMTs embedded in PCB-based power circuits 64
Fast error-bounded MOR-based approximation of heat conduction problems in electronics 64
Optimum module design I: Electrothermal 60
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part II: Approaches based on intersection points 59
Thermo-electrochemical FEM and circuit simulations of Li-ion batteries 57
A technique for the in-situ experimental extraction of the thermal impedance of power devices 55
Structure curve representation of dynamic thermal multi-ports 53
A cost-driven analysis of thermal performance in power modules 49
Numerical investigation on the thermal resistance and assembly cost in SSC and DSC power modules 44
Novel approach to the extraction of sparse nonlinear dynamic compact thermal multi-ports 37
Electro-Thermal Circuit Models of Photovoltaic Cells Subjected to Optical Degradation Phenomena 21
Totale 5.781
Categoria #
all - tutte 18.401
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 18.401


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202187 0 0 0 0 0 7 38 9 3 0 3 27
2021/2022204 3 0 0 3 7 7 22 29 4 1 34 94
2022/2023311 38 19 16 11 40 42 5 34 58 25 15 8
2023/2024396 14 42 85 38 103 5 14 10 9 8 51 17
2024/20251.917 82 132 8 15 51 101 144 140 138 129 700 277
2025/20262.668 464 312 670 516 555 151 0 0 0 0 0 0
Totale 5.781