IRIS
d'ALESSANDRO, VINCENZO
 Distribuzione geografica
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Continente #
AS - Asia 9.670
NA - Nord America 8.696
EU - Europa 6.220
SA - Sud America 1.143
AF - Africa 143
Continente sconosciuto - Info sul continente non disponibili 9
OC - Oceania 7
Totale 25.888
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Nazione #
US - Stati Uniti d'America 8.401
SG - Singapore 4.621
RU - Federazione Russa 2.714
CN - Cina 1.810
VN - Vietnam 1.525
IT - Italia 1.148
BR - Brasile 928
HK - Hong Kong 662
DE - Germania 480
FR - Francia 355
UA - Ucraina 329
FI - Finlandia 263
IE - Irlanda 253
JP - Giappone 210
NL - Olanda 210
BD - Bangladesh 162
CA - Canada 151
GB - Regno Unito 151
IN - India 145
KR - Corea 135
SE - Svezia 113
AR - Argentina 89
MX - Messico 84
IQ - Iraq 55
PL - Polonia 44
ID - Indonesia 40
TH - Thailandia 39
ZA - Sudafrica 35
TW - Taiwan 33
PH - Filippine 32
ES - Italia 31
EC - Ecuador 29
MA - Marocco 27
TR - Turchia 26
VE - Venezuela 26
PK - Pakistan 23
CO - Colombia 20
BE - Belgio 19
CH - Svizzera 19
JO - Giordania 16
AT - Austria 15
PE - Perù 15
PY - Paraguay 15
LT - Lituania 14
NP - Nepal 14
UZ - Uzbekistan 13
SA - Arabia Saudita 12
AE - Emirati Arabi Uniti 11
MY - Malesia 11
JM - Giamaica 10
KE - Kenya 10
LB - Libano 9
NG - Nigeria 9
CI - Costa d'Avorio 8
CL - Cile 8
KZ - Kazakistan 8
BG - Bulgaria 7
CZ - Repubblica Ceca 7
DZ - Algeria 7
ET - Etiopia 7
GT - Guatemala 7
UY - Uruguay 7
AL - Albania 6
CR - Costa Rica 6
CY - Cipro 6
EG - Egitto 6
EU - Europa 6
HU - Ungheria 6
RO - Romania 6
SY - Repubblica araba siriana 6
AU - Australia 5
BO - Bolivia 5
DO - Repubblica Dominicana 5
HN - Honduras 5
KG - Kirghizistan 5
TN - Tunisia 5
AZ - Azerbaigian 4
BB - Barbados 4
BH - Bahrain 4
IR - Iran 4
OM - Oman 4
PA - Panama 4
TT - Trinidad e Tobago 4
BA - Bosnia-Erzegovina 3
CM - Camerun 3
DK - Danimarca 3
DM - Dominica 3
GE - Georgia 3
GR - Grecia 3
HR - Croazia 3
KW - Kuwait 3
LU - Lussemburgo 3
LV - Lettonia 3
ML - Mali 3
MZ - Mozambico 3
NI - Nicaragua 3
PS - Palestinian Territory 3
QA - Qatar 3
RS - Serbia 3
SK - Slovacchia (Repubblica Slovacca) 3
Totale 25.834
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Città #
Singapore 2.133
San Jose 1.129
Moscow 740
Chandler 715
Ashburn 709
Hong Kong 622
Beijing 506
Santa Clara 434
Ho Chi Minh City 430
Dallas 426
Hefei 401
Hanoi 350
Naples 302
Jacksonville 293
The Dalles 254
Lauterbourg 244
Los Angeles 215
Amsterdam 191
Millbury 183
Boston 182
Princeton 180
Tokyo 177
Munich 130
Woodbridge 127
Napoli 121
Buffalo 118
Nanjing 115
New York 108
Wilmington 108
Seoul 106
Fairfield 97
Des Moines 96
São Paulo 91
Redondo Beach 75
Da Nang 68
Haiphong 62
Lawrence 60
Ottawa 60
Helsinki 53
Houston 52
Milan 49
Frankfurt am Main 48
Chicago 47
Kronberg 44
Mexico City 41
Seattle 41
Council Bluffs 40
Turku 40
Atlanta 36
Rio de Janeiro 36
Brooklyn 35
Chennai 35
Dublin 33
Montreal 33
Orem 33
Warsaw 33
Rome 32
Nanchang 31
Shenyang 31
Hebei 30
Denver 27
Ann Arbor 25
Biên Hòa 25
Falkenstein 25
Belo Horizonte 24
Boardman 24
London 24
Pune 24
Can Tho 23
Baghdad 22
Jiaxing 22
Johannesburg 22
Norwalk 22
San Francisco 22
Poplar 21
Redwood City 21
Shanghai 21
Washington 21
Brasília 20
Fidenza 20
Stockholm 19
Tianjin 19
Turin 19
Berlin 18
Hải Dương 18
Toronto 18
Changsha 17
Manchester 17
Phoenix 17
Puglianello 17
Duncan 16
Guangzhou 15
Amman 14
Porto Alegre 14
Zurich 14
Bangkok 13
Ninh Bình 13
Điện Bàn 13
Bacoli 12
Curitiba 12
Totale 13.981
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Nome #
Circuit-based electrothermal simulation of power devices by an ultrafast nonlinear MOR approach 241
Optimum module design II: Impact of parameter design spread 197
Numerical analysis of the dynamic thermal behavior of RF bipolar transistors 197
Circuito per il bypass attivo di sotto-pannelli fotovoltaici basato su un transistore bipolare operante in saturazione 195
A simple electrothermal compact model for SiC MPS diodes including the snapback mechanism 183
SPICE modeling of Li-ion pouch battery cell including thermo-electrochemical effects 174
Dispositivi e sistemi fotovoltaici 170
SPICE modeling and dynamic electrothermal simulation of SiC power MOSFETs 161
Searching for a response: Feynman’s work on the amplifier theory 151
Electrothermal aware design of multichip SiC-based converters for e-mobility 151
Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules 148
Thermally induced current bifurcation in bipolar transistors 147
Effect of heat sources modeling in DC circuit-level electrothermal simulation of power MOSFETs 146
Monitoring and diagnostics of PV plants by a wireless self-powered sensor for individual panels 144
Modellistica analitica e analisi numerica del comportamento termico di transistori bipolari con isolamento a trincea 143
An ultrafast InP/InGaAsP optical modulator 143
FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC) 142
Thermal feedback blocks for fast and reliable electrothermal circuit simulation of power circuits at module level 140
Optimum thermal management design for compact PCB-based high frequency GaN assemblies 139
Analysis of device and circuit parameters variability in SiC MOSFETs-based multichip power module 138
An approach to the measurement of shunt resistance of individual subcells in thin-film tandem devices 137
Electro-thermal circuit models of PhotoVoltaic cells subjected to optical degradation phenomena 136
Studio del fenomeno dell'innesco di instabilita' termiche in MOSFET di potenza per basse tensioni: modellistica analitica e verifica sperimentale 135
Si/SiGe:C and InP/GaAsSb heterojunction bipolar transistors for THz applications 135
3-D FEM investigation on electrical ruggedness of double-sided cooling power modules 135
Effective electrothermal analysis of electronic devices and systems with parameterized macromodeling 134
Novel MPPT algorithm based on individual PV panel monitoring system 133
Fast nonlinear dynamic compact thermal modeling with multiple heat sources in Ultra-Thin Chip Stacking Technology 133
Influence of bumps height on electric field in double sided cooling power modules 133
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 133
Analisi degli effetti di auto-riscaldamento in transistori bipolari SOA 132
Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations 132
A novel simulation strategy for ultrafast InP/InGaAsP optoelectronic modulator analysis 131
Searching for a response: The intriguing mystery of Feynman’s theoretical reference amplifier 131
Accurate yield prediction for PV plants in the presence of shadows due to fully arbitrary obstacles 130
Short-circuit failure mechanism of SiC power MOSFETs 130
Experimental assessment of malfunction events in photovoltaic modules from IR thermal maps 130
Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update 129
A modified bypass circuit for improved hot spot reliability of solar panels subject to partial shading 129
Model-order reduction procedure for fast dynamic electrothermal simulation of power converters 129
Dynamic electrothermal simulation of photovoltaic plants 128
Experimental DC extraction of the base resistance of bipolar transistors: Application to SiGe:C HBTs 128
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies 128
Improving performance of InGaP/GaAs HBT arrays by means of temperature-dependent base ballasting resistors 127
Achieving accuracy in modeling the temperature coefficient of threshold voltage in MOS transistors with uniform and horizontally nonuniform channel doping 126
Modellistica analitica e analisi numerica del comportamento termico di dispositivi trench SOI 126
Stress-induced vertical deformations in state-of-the-art power modules: An improved electro-thermo-mechanical approach 126
Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules 126
Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices 126
Real-time temperature cycling estimation of IGBT power modules with power in-line measurements and compact thermal modeling 125
Optimization of thermal vias design in PCB-based power circuits 125
Connecting MOR-based boundary condition independent compact thermal models 124
Experimental comparison between an "information based" MPPT algorithm and standard P&O in both partial shading and uniform illumination 123
Dynamic electrothermal modeling of solar cells and modules 121
Compact dynamic modeling for fast simulation of nonlinear heat conduction in ultra-thin chip stacking technology 120
Matrix reduction tool for creating boundary condition independent dynamic compact thermal models 120
Modeling thermal coupling in bipolar power amplifiers toward dynamic electrothermal simulation 120
Influence of layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs 119
Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications 119
Thermo-electrochemical simulations in SPICE of Li-Ion batteries under active charge balancing 118
Scaling influence on the thermal behavior of toward-THz SiGe:C HBTs 118
Reliability of high-speed SiGe:C HBT under electrical stress close to the SOA limit 118
Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors 117
Analytical modeling of through-PCB thermal vias and heat-sinks for integrated power electronics 117
Analytical modeling and numerical simulations of the thermal behavior of trench-isolated bipolar transistors on SOI substrates 116
Accurate analysis of small shadows effects on photovoltaic systems yield 116
An efficient simulation methodology to quantify the impact of parameter fluctuations on the electrothermal behavior of multichip SiC power modules 116
Diagnosis of power losses in PV plants by means of UAV thermography 116
Experimental validation of analytical models for through-PCB thermal vias 116
Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction 115
Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM-based tool and Design of Experiments 115
Electrothermal analysis of GaAs-based HBT arrays for RF power amplifiers 115
Compact modeling of a 3.3 kV SiC MOSFET power module for detailed circuit-level electrothermal simulations including parasitics 115
Defect detection in double-sided cooled power modules by structure function 114
Thermal design of multifinger bipolar transistors 114
In-situ thermal impedance extraction technique applied to a PCB-integrated power device 113
Electrothermal behavior of highly-symmetric three-finger bipolar transistors 113
Dynamic electrothermal analysis of bipolar devices and circuits relying on multi-port positive fraction Foster representation 113
Thermal feedback networks for dynamic electrothermal simulations of devices and circuits: A critical perspective 113
Using EMPHASIS for the thermography-based fault detection in photovoltaic plants 113
Single-panel voltage zeroing system for safe access on PV plants 112
Advanced thermal resistance simulation of SiGe HBTs including backend cooling effect 112
High-temperature validated SiC power MOSFET model for flexible robustness analysis of multi-chip structures 112
Study of the thermal behavior of double-sided cooled power modules 112
Dynamic Electrothermal macromodeling techniques for thermal-aware design of circuits and systems 111
Dynamic reconfiguration of solar systems for avoiding MPPT faults due to architectural partial shading 110
Numerical analysis of the thermal behavior sensitivity to technology parameters and operating conditions in InGaP/GaAs HBTs 110
Thermal design of fully-isolated bipolar transistors 109
Thermal effects in thin silicon dies: simulation and modeling 109
Dynamic electrothermal macromodeling: An application to signal integrity analysis in highly integrated electronic systems 109
A wireless sensor network for the monitoring of large PV plants 109
Calibration of detailed thermal models by parametric dynamic compact thermal models 109
Delphi-like dynamical compact thermal models using model order reduction 109
Evaluation of vertical mechanical displacement in SiC-based power modules 108
Electrothermal issues in 4H-SiC 600 V Schottky diodes in forward mode: Experimental characterization, numerical simulation and analytical modeling 107
Validation of thermometer-based techniques to experimentally extract the impact of nonlinear thermal effects on the thermal resistance of bipolar transistors 105
In-depth analysis of the electrical ruggedness of double-sided cooled power modules 105
Analytical model for thermal instability of low voltage power MOS and S.O.A. in pulse operation 105
Scaling influence on the thermal behavior of toward-THz SiGe:C HBTs 105
A priori error bound for moment matching approximants of thermal models 105
Totale 12.848
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Categoria #
all - tutte 87.892
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 87.892
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/20221.317 16 4 7 19 20 52 69 69 243 58 188 572
2022/20231.646 264 121 47 158 194 185 10 148 239 194 62 24
2023/20241.354 48 178 194 134 199 125 38 90 23 25 210 90
2024/20256.728 383 418 32 62 268 270 705 456 491 446 2.437 760
2025/202612.405 1.386 1.012 1.493 1.298 1.989 578 1.184 819 1.365 759 241 281
2026/2027310 310 0 0 0 0 0 0 0 0 0 0 0
Totale 26.819