IRIS
d'ALESSANDRO, VINCENZO
 Distribuzione geografica
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Continente #
AS - Asia 9.714
NA - Nord America 9.441
EU - Europa 6.269
SA - Sud America 1.148
Continente sconosciuto - Info sul continente non disponibili 959
AF - Africa 144
OC - Oceania 7
Totale 27.682
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Nazione #
US - Stati Uniti d'America 9.102
SG - Singapore 4.633
RU - Federazione Russa 2.714
CN - Cina 1.821
VN - Vietnam 1.525
IT - Italia 1.184
BR - Brasile 932
HK - Hong Kong 663
DE - Germania 480
FR - Francia 355
UA - Ucraina 329
FI - Finlandia 263
IE - Irlanda 253
JP - Giappone 211
NL - Olanda 210
BD - Bangladesh 174
CA - Canada 169
GB - Regno Unito 159
IN - India 145
KR - Corea 135
SE - Svezia 113
AR - Argentina 89
MX - Messico 84
IQ - Iraq 55
PL - Polonia 44
ID - Indonesia 40
TH - Thailandia 40
TW - Taiwan 35
ZA - Sudafrica 35
PH - Filippine 34
ES - Italia 32
EC - Ecuador 30
MA - Marocco 27
TR - Turchia 27
VE - Venezuela 26
PK - Pakistan 23
CO - Colombia 20
BE - Belgio 19
CH - Svizzera 19
JM - Giamaica 18
JO - Giordania 16
AT - Austria 15
NP - Nepal 15
PE - Perù 15
PY - Paraguay 15
LT - Lituania 14
UZ - Uzbekistan 13
CR - Costa Rica 12
SA - Arabia Saudita 12
AE - Emirati Arabi Uniti 11
KE - Kenya 11
MY - Malesia 11
GT - Guatemala 10
HU - Ungheria 9
LB - Libano 9
NG - Nigeria 9
CI - Costa d'Avorio 8
CL - Cile 8
KZ - Kazakistan 8
BB - Barbados 7
BG - Bulgaria 7
CZ - Repubblica Ceca 7
DZ - Algeria 7
ET - Etiopia 7
HN - Honduras 7
NI - Nicaragua 7
UY - Uruguay 7
AL - Albania 6
CY - Cipro 6
EG - Egitto 6
EU - Europa 6
RO - Romania 6
SY - Repubblica araba siriana 6
AU - Australia 5
BO - Bolivia 5
DO - Repubblica Dominicana 5
KG - Kirghizistan 5
TN - Tunisia 5
AZ - Azerbaigian 4
BH - Bahrain 4
IR - Iran 4
OM - Oman 4
PA - Panama 4
TT - Trinidad e Tobago 4
BA - Bosnia-Erzegovina 3
CM - Camerun 3
DK - Danimarca 3
DM - Dominica 3
GE - Georgia 3
GR - Grecia 3
HR - Croazia 3
KW - Kuwait 3
LU - Lussemburgo 3
LV - Lettonia 3
ML - Mali 3
MZ - Mozambico 3
PS - Palestinian Territory 3
QA - Qatar 3
RS - Serbia 3
SK - Slovacchia (Repubblica Slovacca) 3
Totale 26.677
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Città #
Singapore 2.142
San Jose 1.395
Ashburn 746
Moscow 740
Chandler 716
Hong Kong 622
Beijing 506
Santa Clara 444
Dallas 430
Ho Chi Minh City 430
Hefei 401
Hanoi 350
Naples 305
Jacksonville 293
The Dalles 254
Lauterbourg 244
Los Angeles 219
Council Bluffs 204
Amsterdam 191
Millbury 183
Boston 182
Princeton 180
Tokyo 177
Munich 130
Woodbridge 127
Napoli 121
Buffalo 119
Nanjing 115
Phoenix 115
New York 110
Wilmington 109
Seoul 106
Des Moines 97
Fairfield 97
São Paulo 94
Redondo Beach 75
Da Nang 68
Haiphong 62
Lawrence 60
Ottawa 60
Helsinki 53
Milan 53
Houston 52
Chicago 48
Frankfurt am Main 48
Kronberg 44
Mexico City 41
Seattle 41
Turku 40
Atlanta 39
Brooklyn 36
Rio de Janeiro 36
Rome 36
Chennai 35
Montreal 34
Dublin 33
Orem 33
Warsaw 33
Nanchang 31
Shenyang 31
Hebei 30
Denver 27
Ann Arbor 25
Biên Hòa 25
Falkenstein 25
Belo Horizonte 24
Boardman 24
London 24
Pune 24
Shanghai 24
Can Tho 23
San Francisco 23
Baghdad 22
Jiaxing 22
Johannesburg 22
Norwalk 22
Washington 22
Poplar 21
Redwood City 21
Brasília 20
Fidenza 20
Toronto 20
Stockholm 19
Tianjin 19
Turin 19
Berlin 18
Changsha 18
Hải Dương 18
Manchester 17
Puglianello 17
Duncan 16
Guangzhou 15
Amman 14
Porto Alegre 14
Zurich 14
Bangkok 13
Ninh Bình 13
Điện Bàn 13
Bacoli 12
Curitiba 12
Totale 14.607
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Nome #
Circuit-based electrothermal simulation of power devices by an ultrafast nonlinear MOR approach 248
Numerical analysis of the dynamic thermal behavior of RF bipolar transistors 202
Optimum module design II: Impact of parameter design spread 200
Circuito per il bypass attivo di sotto-pannelli fotovoltaici basato su un transistore bipolare operante in saturazione 199
A simple electrothermal compact model for SiC MPS diodes including the snapback mechanism 187
SPICE modeling of Li-ion pouch battery cell including thermo-electrochemical effects 177
Dispositivi e sistemi fotovoltaici 173
SPICE modeling and dynamic electrothermal simulation of SiC power MOSFETs 164
Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules 159
Electrothermal aware design of multichip SiC-based converters for e-mobility 157
Searching for a response: Feynman’s work on the amplifier theory 156
Thermally induced current bifurcation in bipolar transistors 150
Effect of heat sources modeling in DC circuit-level electrothermal simulation of power MOSFETs 150
An ultrafast InP/InGaAsP optical modulator 147
Thermal feedback blocks for fast and reliable electrothermal circuit simulation of power circuits at module level 147
Electro-thermal circuit models of PhotoVoltaic cells subjected to optical degradation phenomena 146
Modellistica analitica e analisi numerica del comportamento termico di transistori bipolari con isolamento a trincea 145
FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC) 145
Monitoring and diagnostics of PV plants by a wireless self-powered sensor for individual panels 145
Optimum thermal management design for compact PCB-based high frequency GaN assemblies 141
An approach to the measurement of shunt resistance of individual subcells in thin-film tandem devices 140
3-D FEM investigation on electrical ruggedness of double-sided cooling power modules 140
Analysis of device and circuit parameters variability in SiC MOSFETs-based multichip power module 139
Fast nonlinear dynamic compact thermal modeling with multiple heat sources in Ultra-Thin Chip Stacking Technology 139
Effective electrothermal analysis of electronic devices and systems with parameterized macromodeling 138
Si/SiGe:C and InP/GaAsSb heterojunction bipolar transistors for THz applications 138
Studio del fenomeno dell'innesco di instabilita' termiche in MOSFET di potenza per basse tensioni: modellistica analitica e verifica sperimentale 137
Novel MPPT algorithm based on individual PV panel monitoring system 137
Influence of bumps height on electric field in double sided cooling power modules 137
Short-circuit failure mechanism of SiC power MOSFETs 136
Experimental assessment of malfunction events in photovoltaic modules from IR thermal maps 136
Searching for a response: The intriguing mystery of Feynman’s theoretical reference amplifier 136
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 136
Analisi degli effetti di auto-riscaldamento in transistori bipolari SOA 135
Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations 135
Model-order reduction procedure for fast dynamic electrothermal simulation of power converters 135
A novel simulation strategy for ultrafast InP/InGaAsP optoelectronic modulator analysis 134
A modified bypass circuit for improved hot spot reliability of solar panels subject to partial shading 134
Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update 133
Accurate yield prediction for PV plants in the presence of shadows due to fully arbitrary obstacles 133
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies 133
Experimental DC extraction of the base resistance of bipolar transistors: Application to SiGe:C HBTs 131
Achieving accuracy in modeling the temperature coefficient of threshold voltage in MOS transistors with uniform and horizontally nonuniform channel doping 130
Dynamic electrothermal simulation of photovoltaic plants 130
Optimization of thermal vias design in PCB-based power circuits 130
Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules 130
Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices 130
Improving performance of InGaP/GaAs HBT arrays by means of temperature-dependent base ballasting resistors 129
Stress-induced vertical deformations in state-of-the-art power modules: An improved electro-thermo-mechanical approach 129
Modellistica analitica e analisi numerica del comportamento termico di dispositivi trench SOI 128
Connecting MOR-based boundary condition independent compact thermal models 128
Real-time temperature cycling estimation of IGBT power modules with power in-line measurements and compact thermal modeling 127
Dynamic electrothermal modeling of solar cells and modules 127
Experimental comparison between an "information based" MPPT algorithm and standard P&O in both partial shading and uniform illumination 126
Influence of layout and technology parameters on the thermal behavior of InGaP/GaAs HBTs 125
Modeling thermal coupling in bipolar power amplifiers toward dynamic electrothermal simulation 125
Reliability of high-speed SiGe:C HBT under electrical stress close to the SOA limit 124
Combined SPICE-FEM analysis of electrothermal effects in InGaP/GaAs HBT devices and arrays for handset applications 124
Compact dynamic modeling for fast simulation of nonlinear heat conduction in ultra-thin chip stacking technology 123
Matrix reduction tool for creating boundary condition independent dynamic compact thermal models 123
Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors 122
Thermo-electrochemical simulations in SPICE of Li-Ion batteries under active charge balancing 122
Compact modeling of a 3.3 kV SiC MOSFET power module for detailed circuit-level electrothermal simulations including parasitics 122
Scaling influence on the thermal behavior of toward-THz SiGe:C HBTs 121
An efficient simulation methodology to quantify the impact of parameter fluctuations on the electrothermal behavior of multichip SiC power modules 121
Accurate and efficient analysis of the upward heat flow in InGaP/GaAs HBTs through an automated FEM-based tool and Design of Experiments 120
Analytical modeling of through-PCB thermal vias and heat-sinks for integrated power electronics 119
Diagnosis of power losses in PV plants by means of UAV thermography 119
Defect detection in double-sided cooled power modules by structure function 118
Analytical modeling and numerical simulations of the thermal behavior of trench-isolated bipolar transistors on SOI substrates 118
Thermal design of multifinger bipolar transistors 118
Accurate analysis of small shadows effects on photovoltaic systems yield 118
Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction 118
Electrothermal analysis of GaAs-based HBT arrays for RF power amplifiers 118
Experimental validation of analytical models for through-PCB thermal vias 118
In-situ thermal impedance extraction technique applied to a PCB-integrated power device 116
Dynamic electrothermal analysis of bipolar devices and circuits relying on multi-port positive fraction Foster representation 116
Thermal feedback networks for dynamic electrothermal simulations of devices and circuits: A critical perspective 116
High-temperature validated SiC power MOSFET model for flexible robustness analysis of multi-chip structures 116
Study of the thermal behavior of double-sided cooled power modules 116
Using EMPHASIS for the thermography-based fault detection in photovoltaic plants 116
Single-panel voltage zeroing system for safe access on PV plants 115
Dynamic reconfiguration of solar systems for avoiding MPPT faults due to architectural partial shading 115
Delphi-like dynamical compact thermal models using model order reduction 115
Dynamic Electrothermal macromodeling techniques for thermal-aware design of circuits and systems 115
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part II: Approaches based on intersection points 114
Electrothermal behavior of highly-symmetric three-finger bipolar transistors 114
Advanced thermal resistance simulation of SiGe HBTs including backend cooling effect 114
A wireless sensor network for the monitoring of large PV plants 113
Thermal design of fully-isolated bipolar transistors 112
Dynamic electrothermal macromodeling: An application to signal integrity analysis in highly integrated electronic systems 112
Calibration of detailed thermal models by parametric dynamic compact thermal models 112
Numerical analysis of the thermal behavior sensitivity to technology parameters and operating conditions in InGaP/GaAs HBTs 112
Thermal effects in thin silicon dies: simulation and modeling 111
Evaluation of vertical mechanical displacement in SiC-based power modules 110
In-depth analysis of the electrical ruggedness of double-sided cooled power modules 109
Analytical model for thermal instability of low voltage power MOS and S.O.A. in pulse operation 109
Scaling influence on the thermal behavior of toward-THz SiGe:C HBTs 109
PV fault detection through IR thermography: using EMPHASIS under uneven environmental conditions 109
Electrothermal issues in 4H-SiC 600 V Schottky diodes in forward mode: Experimental characterization, numerical simulation and analytical modeling 108
Totale 13.234
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Categoria #
all - tutte 95.188
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 95.188
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2021/20221.297 0 0 7 19 20 52 69 69 243 58 188 572
2022/20231.646 264 121 47 158 194 185 10 148 239 194 62 24
2023/20241.354 48 178 194 134 199 125 38 90 23 25 210 90
2024/20256.728 383 418 32 62 268 270 705 456 491 446 2.437 760
2025/202612.405 1.386 1.012 1.493 1.298 1.989 578 1.184 819 1.365 759 241 281
2026/20271.173 398 329 446 0 0 0 0 0 0 0 0 0
Totale 27.682