SCOGNAMILLO, CIRO
 Distribuzione geografica
Continente #
NA - Nord America 304
EU - Europa 201
AS - Asia 23
AF - Africa 2
Continente sconosciuto - Info sul continente non disponibili 1
OC - Oceania 1
SA - Sud America 1
Totale 533
Nazione #
US - Stati Uniti d'America 301
IT - Italia 143
DE - Germania 14
FR - Francia 14
IE - Irlanda 13
CN - Cina 5
NL - Olanda 5
SG - Singapore 4
CA - Canada 3
KR - Corea 3
TH - Thailandia 3
TW - Taiwan 3
BE - Belgio 2
CI - Costa d'Avorio 2
ES - Italia 2
FI - Finlandia 2
GB - Regno Unito 2
IN - India 2
JP - Giappone 2
AU - Australia 1
BR - Brasile 1
CH - Svizzera 1
EU - Europa 1
HK - Hong Kong 1
PL - Polonia 1
RO - Romania 1
SE - Svezia 1
Totale 533
Città #
Chandler 77
Naples 72
Fairfield 33
Ashburn 20
Napoli 20
Lawrence 19
Dublin 13
Milan 10
Boston 8
Des Moines 7
Millbury 5
Amsterdam 4
Dresden 4
San Cipriano Picentino 4
Shanghai 4
Dearborn 3
Falls Church 3
Fort St. James 3
Frankfurt am Main 3
New Taipei City 3
Saint-Martin-d'Hères 3
Wilmington 3
Avigliana 2
Bolton 2
Boulogne-Billancourt 2
Chelles 2
Collegno 2
Colombes 2
Grenoble 2
Kronberg 2
Lat Krabang 2
Leuven 2
Osaka 2
Rome 2
Sant'Angelo dei Lombardi 2
Turin 2
Urnieta 2
Woodbridge 2
Abbiategrasso 1
Beijing 1
Bengaluru 1
Bernareggio 1
Brasov 1
Brisbane 1
Caltanissetta 1
Castiglion Fiorentino 1
Catanzaro 1
Central 1
Chiang Mai 1
Columbus 1
Empoli 1
Helsinki 1
Hyderabad 1
Lappeenranta 1
Mannheim 1
Munich 1
Norwalk 1
Paderno Dugnano 1
Parsdorf 1
Portici 1
Possagno 1
Redwood City 1
San Diego 1
San Francisco 1
Seattle 1
Seongnam-si 1
Seoul 1
Singapore 1
Uberlândia 1
Volla 1
Washington 1
Yeongdeungpo-gu 1
Zurich 1
Totale 388
Nome #
SPICE modeling of Li-ion pouch battery cell including thermo-electrochemical effects 94
3-D FEM investigation on electrical ruggedness of double-sided cooling power modules 46
Optimum thermal management design for compact PCB-based high frequency GaN assemblies 31
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 31
Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules 29
Compact modeling of a 3.3 kV SiC MOSFET power module for detailed circuit-level electrothermal simulations including parasitics 28
Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices 28
Numerical simulation and analytical modeling of the thermal behavior of single- and double-sided cooled power modules 27
Optimization of thermal vias design in PCB-based power circuits 21
Circuit-based electrothermal simulation of multicellular SiC power MOSFETs using FANTASTIC 21
Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules 20
Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules 19
Influence of bumps height on electric field in double sided cooling power modules 19
Experimental validation of analytical models for through-PCB thermal vias 19
Stress-induced vertical deformations in state-of-the-art power modules: An improved electro-thermo-mechanical approach 18
Using EMPHASIS for the thermography-based fault detection in photovoltaic plants 17
PV fault detection through IR thermography: using EMPHASIS under uneven environmental conditions 16
Analysis of electrothermal effects in devices and arrays in InGaP/GaAs HBT technology 15
Study of the thermal behavior of double-sided cooled power modules 14
Optimum module design I: Electrothermal 13
Boundary condition independent compact thermal models enhanced by contour elements 10
Improving performance of InGaP/GaAs HBT arrays by means of temperature-dependent base ballasting resistors 9
Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors 7
Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update 7
Validation of thermometer-based techniques to experimentally extract the impact of nonlinear thermal effects on the thermal resistance of bipolar transistors 7
Thermo-electrochemical FEM and circuit simulations of Li-ion batteries 7
Improved nonlinear electrothermal simulation of bipolar transistors: Application to InP/InGaAs DHBTs 6
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part I: Thermometer-based approaches 5
Structure curve representation of dynamic thermal multi-ports 5
Thermo-electrochemical simulations in SPICE of Li-Ion batteries under active charge balancing 5
Defect detection in double-sided cooled power modules by structure function 4
Improving the thermal ruggedness of GaAs HBTs through nonuniform base ballasting optimization 4
Coupled structural and functional characterization and modelling of integrated GaN half-bridge power switches 4
A technique for the in-situ experimental extraction of the thermal impedance of power devices 4
Analysis of the thermal behavior of Li-ion pouch battery cell – Part II: Circuit-based modeling for fast and accurate thermo-electrochemical simulation 4
In-situ extraction of the thermal impedance of GaN power HEMTs embedded in PCB-based power circuits 2
In-situ thermal impedance extraction technique applied to a PCB-integrated power device 2
Determining the contribution of spatial sub-regions to structure functions 2
Totale 620
Categoria #
all - tutte 3.610
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 3.610


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/202017 0 0 0 4 9 3 0 0 0 1 0 0
2020/202136 0 0 0 0 0 1 23 0 1 0 0 11
2021/2022105 0 0 0 0 3 1 22 21 3 0 12 43
2022/2023190 19 8 10 8 28 28 4 19 41 9 8 8
2023/2024272 11 28 61 30 97 5 10 10 5 8 7 0
Totale 620