IRIS
SCOGNAMILLO, CIRO
 Distribuzione geografica
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Continente #
EU - Europa 659
NA - Nord America 507
AS - Asia 496
SA - Sud America 79
AF - Africa 4
OC - Oceania 2
Continente sconosciuto - Info sul continente non disponibili 1
Totale 1.748
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Nazione #
US - Stati Uniti d'America 498
RU - Federazione Russa 296
SG - Singapore 293
IT - Italia 207
CN - Cina 91
BR - Brasile 73
KR - Corea 46
DE - Germania 45
FR - Francia 43
HK - Hong Kong 26
FI - Finlandia 15
IE - Irlanda 14
GB - Regno Unito 8
NL - Olanda 8
CA - Canada 7
BE - Belgio 6
JP - Giappone 6
TW - Taiwan 6
AR - Argentina 4
BD - Bangladesh 4
CH - Svizzera 3
IN - India 3
MY - Malesia 3
PL - Polonia 3
TH - Thailandia 3
AT - Austria 2
AU - Australia 2
AZ - Azerbaigian 2
CI - Costa d'Avorio 2
CY - Cipro 2
ES - Italia 2
ID - Indonesia 2
IQ - Iraq 2
JO - Giordania 2
LT - Lituania 2
RO - Romania 2
CL - Cile 1
ET - Etiopia 1
EU - Europa 1
GE - Georgia 1
KE - Kenya 1
KZ - Kazakistan 1
LI - Liechtenstein 1
MN - Mongolia 1
MX - Messico 1
SA - Arabia Saudita 1
SE - Svezia 1
SK - Slovacchia (Repubblica Slovacca) 1
SV - El Salvador 1
TR - Turchia 1
VE - Venezuela 1
Totale 1.748
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Città #
Singapore 165
Naples 96
Moscow 83
Chandler 77
Hefei 75
Santa Clara 71
Seoul 42
Fairfield 33
Ashburn 24
Hong Kong 21
Napoli 20
Lawrence 19
Dublin 14
Milan 14
Dallas 11
Frankfurt am Main 11
Boston 9
Munich 8
Des Moines 7
Falkenstein 7
Pomigliano d'Arco 7
Seattle 7
Turku 7
Lauterbourg 6
Düsseldorf 5
Los Angeles 5
Millbury 5
Rome 5
Roubaix 5
São José do Rio Preto 5
Acerra 4
Amsterdam 4
Brussels 4
Dresden 4
Helsinki 4
Lappeenranta 4
New York 4
Nuremberg 4
Rio de Janeiro 4
San Cipriano Picentino 4
Shanghai 4
São Paulo 4
Tokyo 4
Beijing 3
Dearborn 3
East Brunswick 3
Falls Church 3
Fort St. James 3
Kangar 3
Montreal 3
New Taipei City 3
Rende 3
Saint-Martin-d'Hères 3
San Francisco 3
Taipei 3
Wilmington 3
Zurich 3
Amman 2
Avigliana 2
Baku 2
Belo Horizonte 2
Bolton 2
Boulogne-Billancourt 2
Brasília 2
Campinas 2
Castelfranco di Sotto 2
Cesa 2
Chelles 2
Collegno 2
Colombes 2
Grenoble 2
Hyderabad 2
Irvine 2
Kronberg 2
Lat Krabang 2
Leuven 2
Limassol 2
Lipari 2
Newark 2
Osaka 2
Phoenix 2
Porto Alegre 2
Sant'Angelo dei Lombardi 2
Turin 2
Urnieta 2
Warsaw 2
Woodbridge 2
Abbiategrasso 1
Addis Ababa 1
Afonso Cunha 1
Alegrete 1
Almaty 1
Alterosa 1
Americana 1
Aparecida 1
Bakersfield 1
Balneário Camboriú 1
Barbacena 1
Bengaluru 1
Bernareggio 1
Totale 1.031
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Nome #
SPICE modeling of Li-ion pouch battery cell including thermo-electrochemical effects 123
3-D FEM investigation on electrical ruggedness of double-sided cooling power modules 72
Optimum thermal design of high-voltage double-sided cooled multi-chip SiC power modules 70
Electrothermal modeling, simulation, and electromagnetic characterization of a 3.3 kV SiC MOSFET power module 70
Optimum thermal management design for compact PCB-based high frequency GaN assemblies 63
Optimization of thermal vias design in PCB-based power circuits 60
Compact modeling of a 3.3 kV SiC MOSFET power module for detailed circuit-level electrothermal simulations including parasitics 58
Accurate and efficient algorithm for computing structure functions from the spatial distribution of thermal properties in electronic devices 56
Stress-induced vertical deformations in state-of-the-art power modules: An improved electro-thermo-mechanical approach 55
Using EMPHASIS for the thermography-based fault detection in photovoltaic plants 54
Numerical simulation and analytical modeling of the thermal behavior of single- and double-sided cooled power modules 53
Influence of bumps height on electric field in double sided cooling power modules 52
Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules 50
Numerical analysis of the thermal impact of ceramic materials in double-sided cooled power modules 50
Experimental validation of analytical models for through-PCB thermal vias 49
Experimental determination, modeling, and simulation of nonlinear thermal effects in bipolar transistors under static conditions: A critical review and update 44
Study of the thermal behavior of double-sided cooled power modules 44
Analytical modeling and numerical simulation of nonlinear thermal effects in bipolar transistors 43
Improving performance of InGaP/GaAs HBT arrays by means of temperature-dependent base ballasting resistors 43
PV fault detection through IR thermography: using EMPHASIS under uneven environmental conditions 43
Thermo-electrochemical simulations in SPICE of Li-Ion batteries under active charge balancing 41
Circuit-based electrothermal simulation of multicellular SiC power MOSFETs using FANTASTIC 41
Defect detection in double-sided cooled power modules by structure function 39
Validation of thermometer-based techniques to experimentally extract the impact of nonlinear thermal effects on the thermal resistance of bipolar transistors 37
Analysis of the thermal behavior of Li-ion pouch battery cell – Part II: Circuit-based modeling for fast and accurate thermo-electrochemical simulation 37
In-situ thermal impedance extraction technique applied to a PCB-integrated power device 37
Analysis of electrothermal effects in devices and arrays in InGaP/GaAs HBT technology 36
Boundary condition independent compact thermal models enhanced by contour elements 33
Determining the contribution of spatial sub-regions to structure functions 31
A study of UIS ruggedness of mismatched paralleled SiC MOSFETs 30
Coupled structural and functional characterization and modelling of integrated GaN half-bridge power switches 30
Thermo-electrochemical FEM and circuit simulations of Li-ion batteries 28
A critical review of techniques for the experimental extraction of the thermal resistance of bipolar transistors from DC measurements–Part I: Thermometer-based approaches 27
Optimum module design I: Electrothermal 27
A technique for the in-situ experimental extraction of the thermal impedance of power devices 26
Improved nonlinear electrothermal simulation of bipolar transistors: Application to InP/InGaAs DHBTs 25
Structure curve representation of dynamic thermal multi-ports 25
In-situ extraction of the thermal impedance of GaN power HEMTs embedded in PCB-based power circuits 25
Improving the thermal ruggedness of GaAs HBTs through nonuniform base ballasting optimization 24
TCAD-based investigation of a 3.3 kV planar SiC MOSFET: BV-RON trade-off optimization 21
GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study 17
In-depth analysis of the electrical ruggedness of double-sided cooled power modules 17
Fast error-bounded MOR-based approximation of heat conduction problems in electronics 17
Enhancing electrical ruggedness in double-sided cooled power modules 16
Numerical investigation on the thermal resistance and assembly cost in SSC and DSC power modules 11
Novel approach to the extraction of sparse nonlinear dynamic compact thermal multi-ports 7
Totale 1.857
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Categoria #
all - tutte 8.834
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 8.834
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2020/202136 0 0 0 0 0 1 23 0 1 0 0 11
2021/2022105 0 0 0 0 3 1 22 21 3 0 12 43
2022/2023190 19 8 10 8 28 28 4 19 41 9 8 8
2023/2024312 11 28 61 30 97 5 10 10 5 8 35 12
2024/20251.197 51 85 3 10 37 82 91 92 108 93 484 61
Totale 1.857