IRIS
CHIARIELLO, ANDREA GAETANO
 Distribuzione geografica
Salva come PNG Salva come JPEG
Continente #
NA - Nord America 496
EU - Europa 252
AS - Asia 31
Totale 779
Salva come PNG Salva come JPEG
Nazione #
US - Stati Uniti d'America 494
UA - Ucraina 62
SE - Svezia 48
NL - Olanda 40
CN - Cina 30
IE - Irlanda 25
IT - Italia 22
FI - Finlandia 21
DE - Germania 17
GB - Regno Unito 11
BG - Bulgaria 3
CA - Canada 1
ES - Italia 1
FR - Francia 1
GL - Groenlandia 1
IN - India 1
ME - Montenegro 1
Totale 779
Salva come PNG Salva come JPEG
Città #
Chandler 104
Jacksonville 69
Woodbridge 50
Amsterdam 40
Houston 30
Ann Arbor 27
Princeton 21
Ashburn 19
Millbury 18
Boston 13
Nanjing 12
Wilmington 9
Los Angeles 8
Naples 5
Boardman 4
Nanchang 4
Norwalk 4
Falls Church 3
San Giorgio A Cremano 3
Sofia 3
Tianjin 3
Beijing 2
Caivano 2
Casoria 2
Dallas 2
Drogheda 2
Hebei 2
Jiaxing 2
Kronberg 2
Orange 2
Shenyang 2
Augusta 1
Changsha 1
Dublin 1
Fuzhou 1
Islington 1
Madrid 1
Marcianise 1
Napoli 1
New York 1
Nuuk 1
Ottawa 1
Podgorica 1
Pune 1
Seattle 1
Shaoxing 1
Totale 484
Salva come PNG Salva come JPEG
Nome #
A 3-D SUPERFICIAL INTEGRAL FORMULATION FOR THE ANALYSIS OF INTERCONNECTS 70
SIGNAL INTEGRITY ANALYSIS OF HIGH-SPEED INTERCONNECTS THROUGH A FULL-WAVE TRANSMISSION LINE MODEL 68
High-frequency full-wave analysis of interconnects with inhomogeneous dielectrics through an enhanced transmission line model 51
Electromagnetic models for metallic carbon nanotube interconnects 49
Broad-Band Characterization of Conductors with Arbitrary Topology Using a Surface Integral Formulation 47
Metallic Carbon Nanotube Interconnects, Part I: a Fluid Model and a 3D Integral Formulation 42
Comparison Between Metallic Carbon Nanotube and Copper Future VLSI Nano-interconnects 41
Evaluation of Crosstalk in High-Frequency Interconnects with an Enhanced Transmission Line Model 40
Full-wave Numerical Analysis of Single-Layered Substrate Planar Interconnects 40
Validazione di una procedura per l'identificazione diretta di multiporta lineari passivi basata sul Positive Fraction Vector Fitting 40
Transmission line models for high-speed conventional interconnects and metallic carbon nanotube interconnects 35
Metallic Carbon Nanotube Interconnects, Part II: a Transmission Line Model 35
Electromagnetic Models for Metallic Carbon Nanotube Interconnects 35
IDENTIFICAZIONE DI MODELLI CIRCUITALI RIDOTTO DI STRUTTURE LINEARI PASSIVE DISTRIBUITE 35
Mode conversion on high-frequency signal propagation on asymmetric interconnects 29
A Superficial Formulation for the broadband analysis of Planar Interconnects 23
High-Frequency Analysis of Radiated Emission from PCB Microstrips Through a Full-Wave Transmission Line Model 23
Scattering properties of a carbon nanotube array 21
Electrical and thermal behaviour of nanopackaging interconnects with conventional and innovative materials 20
An hybrid model for the evaluation of the full-wave far-field radiated emission from PCB traces 19
Size and temperature effects on the resistance of copper and carbon nanotubes nano-interconnects 17
Error field and correction coils in DTT: A preliminary analysis 4
Totale 784
Salva come PNG Salva come JPEG
Categoria #
all - tutte 2.805
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 2.805
Salva come PNG Salva come JPEG


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/202070 23 0 16 0 13 0 0 0 0 0 3 15
2020/2021129 0 14 20 13 14 20 13 1 14 3 15 2
2021/2022130 8 0 0 4 0 14 4 2 23 0 30 45
2022/2023225 23 34 7 17 15 28 0 22 25 41 11 2
2023/202470 5 16 8 19 1 1 3 3 2 10 2 0
Totale 784