A metrological and quality control procedure for Insulated Gate Bipolar Transistor (IGBT) electronic assembly devices for railway traction applications is presented. A micro-nondestructive evaluation (micro-NDE) procedure based on ultrasonic (UT) sensors was carried out according to the full volume scanning method, allowing for the UT axial tomography of the IGBT electronic assembly structure. The geometry and integrity of the IGBT assembly joints was evaluated and critically assessed through UT micro-NDE image analysis.
Metrology and Quality Assurance of Electronic Assembly Devices through Ultrasonic Micro-NDE / Teti, Roberto; I. L., Baciu. - STAMPA. - (2006), pp. 91-101.
Metrology and Quality Assurance of Electronic Assembly Devices through Ultrasonic Micro-NDE
TETI, ROBERTO;
2006
Abstract
A metrological and quality control procedure for Insulated Gate Bipolar Transistor (IGBT) electronic assembly devices for railway traction applications is presented. A micro-nondestructive evaluation (micro-NDE) procedure based on ultrasonic (UT) sensors was carried out according to the full volume scanning method, allowing for the UT axial tomography of the IGBT electronic assembly structure. The geometry and integrity of the IGBT assembly joints was evaluated and critically assessed through UT micro-NDE image analysis.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
