A method is presented for studying bonded assemblies under pure mode III loading. It is based upon a novel fixture that can be mounted on a common universal testing machine and is able of realizing pure anti-plane shear conditions. Twisting of the bonded assembly generates a smoothly propagating circular crack front that allows for accurate measurements during the test. Data reduction is carried out based on the global load-displacement response and material properties are identified. Results are presented that demonstrate the capabilities of the proposed approach to provide mode III fracture parameters of adhesively bonded joints. © 2015 Elsevier Ltd.
A novel fixture for measuring mode III toughness of bonded assemblies / Cricrì, Gabriele; Perrella, Michele; Sessa, Salvatore; Valoroso, Nunziante. - In: ENGINEERING FRACTURE MECHANICS. - ISSN 0013-7944. - 138:(2015), pp. 1-18. [10.1016/j.engfracmech.2015.03.019]
A novel fixture for measuring mode III toughness of bonded assemblies
Cricrì, Gabriele
;Perrella, Michele;Sessa, Salvatore;
2015
Abstract
A method is presented for studying bonded assemblies under pure mode III loading. It is based upon a novel fixture that can be mounted on a common universal testing machine and is able of realizing pure anti-plane shear conditions. Twisting of the bonded assembly generates a smoothly propagating circular crack front that allows for accurate measurements during the test. Data reduction is carried out based on the global load-displacement response and material properties are identified. Results are presented that demonstrate the capabilities of the proposed approach to provide mode III fracture parameters of adhesively bonded joints. © 2015 Elsevier Ltd.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.
