A surface integral formulation is used for a broad-band characterization of wire interconnects. A suitable definition of effective impedance accounts for the penetration of currents and charges inside lossy conductors. The results are successfully compared to a volumetric integral approach.
Broad-band characterization of wire interconnects using a surface integral formulation with a surface effective impedance / Maffucci, A.; Rubinacci, Guglielmo; Ventre, S.; Villone, F.; Zamboni, W.. - In: APPLIED COMPUTATIONAL ELECTROMAGNETICS SOCIETY JOURNAL. - ISSN 1054-4887. - STAMPA. - 23:(2008), pp. 23-30.
Broad-band characterization of wire interconnects using a surface integral formulation with a surface effective impedance
RUBINACCI, GUGLIELMO;F. Villone;
2008
Abstract
A surface integral formulation is used for a broad-band characterization of wire interconnects. A suitable definition of effective impedance accounts for the penetration of currents and charges inside lossy conductors. The results are successfully compared to a volumetric integral approach.File in questo prodotto:
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