Abstract—The paper presents a generalized transmission line model able to describe the high-frequency mixed-mode propagation along electrical interconnects. The model is derived from a full-wave formulation and extends the validity of the standard transmission line (TL) model to frequency ranges where the propagation is no longer of transmission electron microscopy (TEM)-type. This generalized TL model describes the high-frequency differential and common mode propagation and the mode conversion.Within its validity limits, the proposed model provides solutions in good agreement with those obtained through full-wave models. Case studies are carried out to evaluate the high-frequency mode conversion in asymmetric interconnects.

A Transmission-line Model for Full-wave Analysis of Mixed-mode Propagation / CHIARIELLO A., M; Maffucci, M; Miano, Giovanni; Villone, F; Zamboni, W.. - In: IEEE TRANSACTIONS ON ADVANCED PACKAGING. - ISSN 1521-3323. - STAMPA. - 31:2(2008), pp. 275-284. [10.1002/cta.396]

A Transmission-line Model for Full-wave Analysis of Mixed-mode Propagation

MIANO, GIOVANNI;VILLONE F;
2008

Abstract

Abstract—The paper presents a generalized transmission line model able to describe the high-frequency mixed-mode propagation along electrical interconnects. The model is derived from a full-wave formulation and extends the validity of the standard transmission line (TL) model to frequency ranges where the propagation is no longer of transmission electron microscopy (TEM)-type. This generalized TL model describes the high-frequency differential and common mode propagation and the mode conversion.Within its validity limits, the proposed model provides solutions in good agreement with those obtained through full-wave models. Case studies are carried out to evaluate the high-frequency mode conversion in asymmetric interconnects.
2008
A Transmission-line Model for Full-wave Analysis of Mixed-mode Propagation / CHIARIELLO A., M; Maffucci, M; Miano, Giovanni; Villone, F; Zamboni, W.. - In: IEEE TRANSACTIONS ON ADVANCED PACKAGING. - ISSN 1521-3323. - STAMPA. - 31:2(2008), pp. 275-284. [10.1002/cta.396]
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11588/106544
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